| 摘要 |
PURPOSE: To peel in a short time at low temp. in a good state and to prevent well corrosion of a metal thin film on a substrate by preparing a peeling liquid compsn. from hydrofluoric acid, water-soluble org. solvent and corrosion preventing agent. CONSTITUTION: This compsn. contains hydrofluoric acid, water-soluble org. solvent and corrosion preventing agent. The compounding ratio in the peeling liquid compsn. is 0.5-40wt.% hydrofluoric acid component, 40-99.5wt.% water-soluble org. solvent component and 0.5-40wt.% corrosion preventing agent component. If the proportion of the hydrofluoric acid component is <0.5wt.%, the peeling property of a modified film decreases. If the proportion exceeds 40wt.%, it is not preferable because the substrate, especially an Al or Al-Si substrate which is easily corroded is corroded. If the proportion of the water-soluble org. solvent component is <40wt.%, peeling of an org. film is not enough, and if it exceeds 99.5wt.%, the peeling property of a modified film decreases. If the proportion of the corrosion preventing agent component is <0.5wt.%, a substrate which is easily corroded is corroded, and if it exceeds 40wt.%, the stripping resistance decreases. |
