发明名称 Resistive film
摘要 A resistive layer with the elements nickel, chromium, aluminum, cooper and silicon has a low temperature coefficient and a high degree of long-time stability. The copper content is to 5.5 weight-% and the silicon content is 0.5 to 1.6 weight-%, respectively in relation to aluminum, and the ratio of Ni: Cr: AlSiCu is within a range which is defined by a hexagon ABCDEF shown in FIG. 1, the corner points of which are provided by the following compositions in weight-%: - A 58 Ni 40 Cr 2 AlSiCu - B 52 Ni 33 Cr 15 AlSiCu - C 32 Ni 33 Cr 35 AlSiCu - D 13 Ni 52 Cr 35 AlSiCu - E 13 Ni 75 Cr 12 AlSiCu - F 18 Ni 80 Cr 2 AlSiCu. -
申请公布号 US5543208(A) 申请公布日期 1996.08.06
申请号 US19950372076 申请日期 1995.01.12
申请人 RMT REINHARDT MICROTECH AG 发明人 HASLER, PETER
分类号 H01C7/00;H01C17/12;(IPC1-7):B32B9/00 主分类号 H01C7/00
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