| 摘要 |
<p>PURPOSE: To screen out defective semiconductor devices without visual check so as to lessen the devices in manufacturing cost by a method wherein the periphery of a semiconductor wafer, which is liable to be defective in shape when semiconductor wafers possessed of a pn junction respectively are laminated and diced into devices, is not bonded to a support jig. CONSTITUTION: Semiconductor wafers 10 possessed of a pn junction respectively are laminated into a laminated body 1, and the laminated body 1 is placed on a support jig 4, bonded with adhesive agent 5, and diced into square pillars. The pillars on the periphery 8 of the laminated body 1 becomes partially round in cross section and they are useless pillars 22 because of their shape. The support jig 4 has a cut 8 in its edge so that it will not hold the periphery 8 of the laminated body 1. The useless pillars 22 are cut off from the square pillars 21 at dicing and screened out at cleaning.</p> |
