| 发明名称 |
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT |
| 摘要 |
The resin composition comprises epoxy resin of cresol nobolak type, curing agent, curing accelerator, plasticizer, inorganic filler and 0.1-20wt.% high functional epoxy resin of formula(I) with respect to the total resin composition. In formula, R1 and R2 is (CH2)nCH3 or H2; n is 0 or over 1.
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| 申请公布号 |
KR960010305(B1) |
申请公布日期 |
1996.07.30 |
| 申请号 |
KR19910021870 |
申请日期 |
1991.11.30 |
| 申请人 |
CHEIL IND. INC. |
发明人 |
KIM, HWAN - KUN;LEE, BYUNG - WON;LEE, JI - YUN |
| 分类号 |
C08G59/14;C08G59/40;C08G73/16;C08L63/04;H01L23/29;(IPC1-7):C08L63/04 |
主分类号 |
C08G59/14 |
| 代理机构 |
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