Manufacturing multiple layer two=dimensional and three=dimensional circuit boards

摘要

In the manufacturing process for making conductive connections or tracks, fluid metal and fluid plastic is sprayed onto a substrate and sticks to it. The spray nozzle and the substrate are moved relative to each other, as required. The beam of metal is preferably homogeneous and is incident on the substrate without mixing with the surrounding gases. Preferably, the metal is sprayed on a material with a lower or equal melting point. Alternatively, it may be sprayed on a material with a higher melting point. The metal is preferably sprayed in an inert gas atmosphere. Using this method, several conductive tracks may be formed. Individual planes are connected by spraying over and, if desired, using additional heat sources.