发明名称 |
Verfahren zur Herstellung einer Halbleitervorrichtung mit Lotanschlussdrähten aus unterschiedlichen Materialien |
摘要 |
Disclosed is a semiconductor device comprising a semiconductor integrated chip (11) having at least a power processing circuit (12b) in which larger current flows and a signal processing circuit (12a) in which smaller current flows each having bonding pads (15 and 16), a package having leadframes (14 and 17) on which the semiconductor integrated chip (11) is mounted, and a plurality of bonding wires (15 and 16) with different materials through which the bonding pads (13a and 13b) are joined to the leadframes (14 and 17). <IMAGE> |
申请公布号 |
DE69119946(D1) |
申请公布日期 |
1996.07.11 |
申请号 |
DE1991619946 |
申请日期 |
1991.03.15 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
发明人 |
OTA, MASAKI, IBO-GUN, HYOGO-KEN, JP |
分类号 |
H01L21/60;H01L21/607;H01L23/49;H01L23/495 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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