摘要 |
PURPOSE: To obtain a component mounting apparatus by which a component comprising a recessed part on the surface can be mounted onto a printed-circuit board easily and with good accuracy by a method wherein a suction nozzle which pulls up the component by making an air vacuum act from the upper part is arranged and installed at the inside of sandwiching and holding claws which grip the component. CONSTITUTION: A chuck unit with which a component gripping head is provided is provided with a mounting member 19 which is moved in the up-and-down direction with reference to sliding members 18a, 18b which are moved in the up-and-down direction with reference to a pressure member 17. A suction nozzle 20 is attached to the lower end part of the mounting member 19, and one pair of front claws 21, 21 and side claws 22, 22 as sandwiching and holding claws are installed so as to correspond to the suction nozzle 20. An electronic component which is housed on a conveyance tape so as to be conveyed is first sucked from the upper part by means of the suction nozzle 20, it is then gripped by the pair of front claws 21, 21, and it is then gripped by the pair of side claws 22, 22 which are situated in a direction at right angles to the front claws 21. Thereby, the electronic component is position-regulated from four directions so as to be conveyed to a prescribed mounting position. |