| 摘要 |
This invention improves a machine that has a squeegee-like blade that wipes across an apertured mask to apply to a printed circuit board solder paste or other conductive mounting material. The apparatus and method of the invention involve reciprocating the blade back and forth transverse to the direction of blade sweep across the mask, during the material-applying sweep of the blade across the mask. The reciprocating movement of the blade, combined with the sweep movement, deposits material onto the printed circuit board with high fidelity and with minimal voids.
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