| 摘要 |
PURPOSE: To prevent ILB failures caused by the deviation of inner leads from electrodes from occurring due to the direction in which electrodes are arranged by a method wherein the electrodes are bonded to the inner leads as vibrations set up at an angle with the side of a semiconductor chip are given to a bonding tool. CONSTITUTION: A semiconductor chip 1 is formed like a rectangle which is possessed of opposed sides 101 and 102 that extend rectilinearly in an X direction or a lengthwise direction in which a film carrier tape is transferred and another opposed sides 102 and 104 that extend in a Y direction or a crosswise direction, wherein 100μm square electrodes are arranged along the sides of the semiconductor chip 1. Therefore, ultrasonic vibrations of 60KHz are applied in a direction of 14 or an angle of θ1 with an X direction to the electrode 2 and an inner lead 3 located on the electrode 2 by a bonding tool 42 fixed to the tip of a horn 7 so as to bond them together at a low temperature of 150 deg.C with a low loading of 30g. |
