| 摘要 |
PURPOSE: To arrange conductive particles to a high density without using any special photomask or laser application device by plating a predetermined metallic foil to provide projections, and removing the metallic foil with an etchant after formation of an insulative film. CONSTITUTION: Metallic foil 1 has a rough surface with an average roughness of 1μm or more, where the average peak-to-peak distance of the sectional curve of its roughness is in the range of 10 to 60μm. After the foil 1 is plated 2 to provide projections so that the crests are further 5μm or more higher, an insulating film 3 is formed into a thickness by which part of the end of each projections 2 is exposed. The foil 1 is then removed with an etchant until the metal on the surface of the film 3 in contact with the foil 1 is formed into lands. After the formation of the film 3, the end of each projection 2 exposed form the film 3 is plated with a metal which, when the foil 1 is removed by etching, can prevent removal of the exposed end by etching. Therefore, the positions of conductive particles can be arranged to a high density without using any special method.
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