| 摘要 |
<p>A method of adhesive application is provided which comprises supplying pressurised fluid in pulses to an adhesive applicator 7 so as to provide a pulsed adhesive output from the applicator. Apparatus for carrying out the method by means of a fluidic a stable circuit 11 is described. The invention may for example be used to bond materials together in the assembly of cardboard boxes, and aims to give strength properties close to or equivalent to those achievable with a continuous glue line but using substantially less glue. <IMAGE></p> |
