| 摘要 |
<p>PURPOSE: To improve solder wettability of an outside connection electrode and to provide a surface packaging module which does not break an outside connection electrode during manufacturing, has good division operativity and corresponds to production of various kinds in a small quantities at a low cost. CONSTITUTION: The title module is acquired by dividing a lamination substrate whereon a part is mounted, a pattern element and a wiring pattern constituting a passive part, or either thereof and an outside connection electrode 2 are provided and the outside connection electrode 2 is formed crossing a division part S4 of a lamination substrate and is further coated with solder excepting at least the division part S4.</p> |
