Wafer holder for semiconductor wafer polishing machine

摘要

A semi-conductor wafer polishing machine (10) having at least one polishing pad assembly (12) and at least one wafer holder (18) positioned to hld a semi-conductor wafer against the polishing pad assembly (12) includes a joint (20) having two axes of rotation intersecting at a centre of rotation. A wafer chuck (32) is supported on the joint (20) adjacent the periphery of the chuck (32) to provide higher material removal rates at the centre of the wafer than the periphery of the wafer during polishing.