| 摘要 |
<p>PURPOSE: To obtain a semiconductor device in which the deterioration of mechanical and electrical reliability is suppressed by reducing thermal stress at the joint to a circuit board. CONSTITUTION: A lead 32 is extended while fixing the forward end at one end part 33 to the vicinity of the central part of semiconductor chip 34 sealing part 38 and connecting the forward end at the other end part 40 with a circuit board 41 at a connecting part 42. Although relative deformation takes place between an enclosure 37 and the circuit board 41 upon heating of the semiconductor chip 34 due to difference in the coefficient of linear expansion, correlation of thermal deformation is very low between the outer side face of the enclosure 37 significantly susceptible to deformation and the joint 42 to the circuit board 41. Since the deformation of the enclosure 37 on the outer side face having relatively high rigidity has no effect on the joint 42 to the circuit board 41, thermal stress at the joint 42 is reduced thus suppressing the deterioration of mechanical and electrical reliability.</p> |
