| 摘要 |
According to the invention, an interconnection support (30) is fabricated and provided with first and second assemblies of welding elements (32a, 32b), the module to be hybridized is fabricated and provided with pads which are wettable by the solder, and which are arranged facing the elements of the first assembly during hybridization, a replacement module is fabricated and provided with solder wettable pads which are arranged facing the elements of the second assembly during hybridization. In order to replace the module which has been hybridized, the module is dehybridized and the replacement module is hybridized by means of the second assembly of elements. Application to infrared detection devices. |
