| 摘要 |
PURPOSE: To obtain a substrate for a multi-chip module capable of increasing a mounting density by mounting semiconductor elements on both the surfaces of the substrate thereby effectively utilizing the surfaces of the substrate and also capable of providing good heat radiation. CONSTITUTION: A metal plate 23 for heat radiation is sandwiched between at least two alumina laminated substrates 21 and 22 and simultaneously baked as one united body, which contains substrates mounting semiconductors on both the surfaces, a ceramics package 29 having a thermal via 32 inside which is connected to at least part of the metal plate 23 of the substrate when the substrate has been mounted, and a heat radiating member 36 attached to the ceramic package 29 in such a manner that it can be connected to the thermal via 32. |
