Passive alignment and packaging of optoelectronic components to optical waveguides using flip-chip bonding technology

摘要

A method and apparatus for automatic passive alignment of optical waveguides with photonic devices to provide for high volume production of optical components at low cost. The invention includes an optical waveguide having an extremity for transmission of light there through. A first wetable pad is mechanically coupled with the waveguide and is arranged at a selected lateral distance from the extremity of the waveguide. The invention further includes a photonic device having a central region on a surface of the photonic device. A second wetable pad is mechanically coupled with the photonic device and is arranged at a selected lateral distance from the central region of the photonic device. A suitable material, for example solder, is chosen and used in a bond for holding the first pad in alignment with the second pad, so as to substantially provide a desired optical alignment of the extremity of the waveguide with the central region of the photonic device. The chosen material is in a liquid form as it is disposed in contact with the first and second wetable pads. Surface tension of a controlled volume of the chosen material pulls the first wetable pad into alignment with the second wetable pad, thereby substantially aligning the extremity of the waveguide with the central region of the photonic device.