| 摘要 |
PURPOSE: To prevent a defect in wire, such as wire sweeping or a short circuit, by covering a package entirely with a coating material after a wire bonding step is carried out. CONSTITUTION: A coating material like perylene dimer is entered in an inlet opening and fed to a vaporizing chamber 11 through a line L4. The coating material is heated by a heating means at the vaporizing chamber 11. The perylene dimer gas is transported through a line L3 and heated at a heat decomposition chamber 12. The decomposed perylene monomer gas is fed to a coating chamber 13 and sprayed to a wire-bonded package at the coating chamber 14 to form a conformal coating film. As a result, a defect in wire, such as wire sweeping, a wire drop or a short circuit can be prevented. |
