| 摘要 |
PURPOSE:To perform exposing by setting each shot region, under an optimum condition, to the focusing surface of a projection type optical system, not depending on the surface condition (projected or recessed) of the shot region of a photosensitive substrate. CONSTITUTION:Position in the direction Z is detected at the measuring points P1 to P5 on the shot region of a wafer W and distribution of projected and recessed areas on the shot region is obtained from the detected result and known data of process structure. For instance, when a pattern of the narrowest line width is exposed to the pattern region 40B, a level difference (ZA-ZB) of the other region obtained with reference to that pattern region 40B is added as the offset to the height of the best focusing surface 42, considering the pattern region 40B as the reference surface for focusing. The pattern region 40B is focused to the best focusing surface 42 by setting the exposing surface to the focusing surface 42A after the addition. |
