发明名称 WIRE BONDING MONITOR
摘要 PURPOSE:To enable a wire bonding operation to be monitored in real time by a method wherein an impedance detector which detects impedance basing on the operating voltage and current of an ultrasonic wave generator, an AD converter, and a discriminating circuit are provided. CONSTITUTION:A wire bonding device 10 is equipped with an ultrasonic wave generating device 12 and a capillary 11 connected to it, wherein an impedance detector which detects impedance basing on the operating voltage and current of the ultrasonic wave generating device 12 is provided. An AD converter 13 is provided to convert analog output signals outputted from the impedance detector corresponding to impedance into digital signals. Furthermore, a discriminating circuit 14 is provided, which outputs an alarm signal on a comparison between the digital signal of the AD converter 13 and a previously set reference value when it is found that the digital signal deviates from the reference value.
申请公布号 JPH0817875(A) 申请公布日期 1996.01.19
申请号 JP19940173362 申请日期 1994.06.30
申请人 MITSUMI ELECTRIC CO LTD 发明人 MAKI TOSHIMITSU;KIKUCHI NAOKI;SAKAI KATSUHIRO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
代理机构 代理人
主权项
地址