发明名称 MOUNTING STRUCTURE OF ELECTRONIC PART
摘要 <p>PURPOSE:To provide the mounting structure of an electronic part on which the inductance component of a connection member is removed. CONSTITUTION:Transmission lines 12 and 13 and the first earth electrode 14 are formed on the surface of an insulated substrate 11, the second earth electrode 15 is formed on the back side of the insulated substrate 11, and a circuit substrate 16 is constituted, and an electronic part 1, consisting of a multilayer dielectric substrate 2 and having a circuit element 3 and input/output electrodes 4 and 5 which makes a continuity with the circuit element 3 and a ground electrode 6 formed in the inner part, is mounted on the surface of the circuit element 3. The transmission lines 12 and 13 of the circuit substrate 16, the input/output electrodes 4 and 5 of the electronic part 1, the earth electrode 14 of the circuit substrate 16, and the ground electrode 6 of the electric part 1 are electromagnetically coupled.</p>
申请公布号 JPH088519(A) 申请公布日期 1996.01.12
申请号 JP19940141796 申请日期 1994.06.23
申请人 MURATA MFG CO LTD 发明人 TONEGAWA KEN;BANDAI HARUFUMI;TSURU TERUHISA;KATOU MITSUHIDE;FURUYA KOUJI
分类号 H05K3/32;H05K1/02;H05K1/18;H05K3/30;H05K3/46;(IPC1-7):H05K3/32 主分类号 H05K3/32
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