| 发明名称 |
Thin film semiconductor device and fabrication method. |
| 摘要 |
A chip card having a chip with a critical curvature causing breakage smaller than that of the chip card is disclosed, the chip being disposed within +/-2.5% of one-half of the thickness of the IC card. <IMAGE> |
| 申请公布号 |
EP0637841(A3) |
申请公布日期 |
1995.11.29 |
| 申请号 |
EP19940305580 |
申请日期 |
1994.07.28 |
| 申请人 |
HITACHI, LTD. |
发明人 |
USAMI, MITSUO;TASE, TAKASHI |
| 分类号 |
H01L25/00;G06K19/077;H01L21/60;H01L21/68;H01L21/70;H01L21/84;H01L23/00;H01L23/498;H01L23/538 |
主分类号 |
H01L25/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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