发明名称 MODULAR RELAY
摘要 The modular relay has a base (1) on which a relay system (2, 3, 4) is constructed, as well as a printed circuit board (6) which stands upright on the base. Contact elements (41c, 42c, 43) of the relay are directly connected to flat connectors in the base, via conductor elements. Further conductor elements in the base likewise form flat connector as connections for a modular circuit which is arranged on the printed circuit board. All conductor elements of the base additionally form solder connecting pins (51b to 56b), which are integrally formed, all emerge in a row on one side wall of the base, and are soldered to the printed circuit board in the lower edge region of said printed circuit board. This results in a compact modular structure for a relay having a maximum number of connecting elements, the allocation of these connecting elements being variable for different modular circuits.
申请公布号 CA2189458(A1) 申请公布日期 1995.11.16
申请号 CA19952189458 申请日期 1995.05.02
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BUESCHER, THOMAS;REISS, HEIKO
分类号 H01H50/02;H01H50/04;H01H50/14;(IPC1-7):H01H50/14 主分类号 H01H50/02
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