| 摘要 |
<p>PURPOSE:To secure enough adhesion, and make this board excellent in processability, and besides, to see that it does not hinder the connection with a bonding wire. CONSTITUTION:A resinous mask member (one soluble in a solvent and/or exfoliatable one) is arranged to cover the specified place of the surface of the first wiring board which is equipped with a specified wiring pattern 13 on the surface and an unetched conductive layer on the rear, and a prepreg member (polycarbonate, or the like) before heating compression 3A is arranged on the mask member 2, and hereon a specified second wiring board (or a copper foil) is arranged, and these are heated and bonded integrally. Then, a through hole is bored, and the inside periphery, etc., of the through hole are plated, and the unetched conductive layers 12A and 43A are etched to form an opening, and the mask member 2 is exfoliated (dissolved or exfoliated), and an opening is made to expose the bonding part.</p> |
