| 摘要 |
A new and improved integrated circuit cooling apparatus includes a heat-conductive base plate to be placed against an integrated circuit, a Peltier Effect cooling module having a cooling side connected to a top surface of the heat-conductive base plate, a heat radiator assembly connected to a heating side of the Peltier Effect cooling module, and a fan assembly juxtaposed next to a heat-radiating portion of the heat radiator assembly. The Peltier Effect cooling module cools the integrated circuit, and the fan assembly cools heat radiated from the heat radiator assembly. The heat radiator assembly can include threaded channels, and the fan assembly includes connection apertures adapted to be placed in registration with the threaded channels of the heat radiator assembly. Threaded connectors, such as screws, arc adapted to connect to the threaded channels to connect the fan assembly to the heat radiator assembly. The Peltier Effect cooling module and the fan assembly are powered, in parallel, by a common power source such as a 12 VDC power source for a standard computer housing ventilation fan. The heat-conductive base plate, the Peltier Effect cooling module, the heat radiator assembly, and the fan assembly arc fabricated as a unified retrofitting module capable of being placed on an integrated circuit. A quantity of a heat-conductive, double-sided adhesive tape material can be placed between the integrated circuit and the bottom surface of the heat-conductive base plate for securing the apparatus to the integrated circuit.
|
