<p>The addition of a low viscosity (2-100 centipoise) polysiloxane such as a polydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices.</p>
申请公布号
DE3751462(D1)
申请公布日期
1995.09.21
申请号
DE19873751462
申请日期
1987.05.18
申请人
AT & T CORP., NEW YORK, N.Y., US
发明人
CHING-PING, WONG, LAWRENCEVILLE NEW JERSEY 08648, US