| 摘要 |
To encapsulate IC chips or other parts located in openings in a tape carrier, upper and lower mold halves are closed forming a cavity about each chip. The lower mold half has a lower mold part containing a lower cavity half, and a front wall extending down to a runner groove. A slide normally covers the runner groove and contains runner channels leading to a small side gate in each cavity, without any plastic contacting the tape. After molding the upper mold half is raised and ejector pins push the molded parts with it, away from the lower mold half, performing auto degating. The molded parts are then ejected from the upper mold half, the slide is retracted and the plastic in the runner system is ejected. This allows reel to reel encapsulation of chips or other parts on a tape. |
