| 摘要 |
<p>An enclosure for protectively housing a printed circuit board 12 in an electronic circuit module 10 includes a base 20 having an internal surface 21 and an external surface 22. The base 20 includes a pair of raised mounting pads 23 formed on the internal surface 21 which define respective mounting surfaces 24. A pair of channels 26 are also formed on the internal surface 21 of the base 20. The enclosure further includes a cover 30 having a panel portion 31 and a pair of end wall portions 32, 33. Respective projections 34, 35 are formed on each of the end wall portions 32, 33 which define grooves 36, 37 therein. The cover 30 is assembled to the base 20 by inserting the edges of the end wall portions 32, 33 provided on the cover 30 into the channels 26 provided on the base 20. A plurality of spring clips 40 is disposed within each of the grooves 36, 37 provided on the cover 30. The spring clips 40 can be positioned at any desired location along each of the grooves 36, 37. When the cover 30 is connected to the base 20, the spring clips 40 urge electrical components 14 mounted on the printed circuit board 12 into abutment with the mounting pads 23 provided on the base 20. As a result, a firm mechanical engagement is maintained between the electrical components 14 and the mounting pads 23. The mounting pads 23 conduct heat generated by electrical components 14 away therefrom for dissipation. <IMAGE></p> |
