Process for encapsulating a semiconductor package having a heat sink using a jig

摘要

A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires. The radiator block is then positioned on a lower die and an upper die is positioned on top of the lower die and a resin is injected into a cavity formed by the two dies so as to mold the resin and form a package which encapsulates at least a part of the radiator block, the semiconductor chip, the wires and inner leads of the lead frame so that the outer leads of the lead frame extend outwardly of the package and the bottom part of the radiator block projects from the package by a predetermined length to conduct heat generated from the semiconductor chip outside the package. The jig then is removed from the package.