| 摘要 |
<p>PURPOSE:To provide a bump for semiconductor elements which can absorb the distortion generated by the thermal expansion or contraction difference between the semiconductor element and a board in case of the connection of the semiconductor element with the board fatigue fracture and therefore is hard to generate. CONSTITUTION:In a bump for semiconductor elements, on an electrode pad 12 of a semiconductor element 11 present on a wafer, a bump core 14 made of a polymer which has a smaller area than the electrode pad part 12 is provided, and the bump core 14 is covered with a conductive film 16, and further, the lower end of the conductive film 16 is stuck on the electrode pad 12.</p> |
