发明名称 |
SOLDER BALL ELECTRODE FORMING METHOD AND SOLDER MICROSCOPIC SPHERE POSITIONING JIG USED FOR THE METHOD |
摘要 |
PURPOSE:To easily but completely attach a microscopic solder balls to the main body of a semiconductor element. CONSTITUTION:A semiconductor element main body 16 is inserted into a recessed part 15a, a large quantity of solder fine balls 17 are dropped on the rear surface 15c in the state wherein the rear surface 15c of a solder fine ball positioning jig 15 is faced upward, the solder fine balls are dropped into a hole 15b, and the solder fine balls are connected to the semiconductor element body 16 by heating. As a result, the solder fine balls 17 can be arranged easily but completely on the pad 18 formed on the rear surface of the semiconductor element main body 16 without using complicated equipment. |
申请公布号 |
JPH07212021(A) |
申请公布日期 |
1995.08.11 |
申请号 |
JP19940007252 |
申请日期 |
1994.01.26 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
HASHIZUME JIRO;SAITO HIROSHI;KUZUHARA KAZUNARI |
分类号 |
H05K3/34;H01L21/60;H01L23/12;H05K3/24;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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