发明名称 METHOD FOR POLISHING WAFER AND PARALLELISM CONTROLLER
摘要 PURPOSE:To obtain a mirror-finished plane excellent in pararellism by detecting the temperature of the surface of a rotary surface plate and its surface strain to compare them with set values and by controlling the temperature and the flow rate of an abrasive supplied on the basis of their compared values to control the thermal deformation quantity of the rotary surface plate and to almost uniform pressure distributions in a waer finished plane. CONSTITUTION:An abrasive 11 is supplied while a rotary surface plate 10 with a polishing cloth 8 adhered on the surface is being rotated around its rotary drive, and wafers 4 adhered on a disk 2 being pressed to the polishing cloth 8 by a press disk 1, whereby the wafers 4 are polished. In that case, the temperature of the surface of the rotary surface plate 10 surface and its surface strain are detected, and a detected temperature and a detected surface strain are compared with a preset temperature and surface strain to control the temperature and the flow rate of the abrasive 11 supplied on the basis of their compared values, so that the thermal deformation quantity of the surface plate 10 is controlled to almost uniform pressure distributions in a wafer finished plane.
申请公布号 JPH07201790(A) 申请公布日期 1995.08.04
申请号 JP19930350519 申请日期 1993.12.29
申请人 NIPPON STEEL CORP 发明人 YOSHIDA TAKAFUMI;OMOTO TAKASHI
分类号 B24B1/00;B24B37/005;H01L21/304 主分类号 B24B1/00
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