发明名称 WIRE BONDER
摘要 <p>PURPOSE:To avoid the decline of a utilization factor by a method wherein the misregistration of the island of a lead frame which is caused by the expansion of a lead frame produced by the heat of a heater is detected and automatically corrected. CONSTITUTION:After a certain distance of the row feed of a lead frame 1 is performed in order to perform the wire bonding operation of the next row, a control unit 14 detects whether an island is on the dimple 4 of a heater plate or not by input signals from an island backward misregistration detecting sensor 7 and an island forward misregistration detecting sensor 8 which are provided on both side edges of the dimple 4 and detects the discrepancy and outputs a feed direction step correction 20 which instructs a feed direction so as not make the sensors detect the lead frame to a lead frame feed 11. The position of the lead frame is corrected until the lead frame is not detected.</p>
申请公布号 JPH07176562(A) 申请公布日期 1995.07.14
申请号 JP19930317593 申请日期 1993.12.17
申请人 NEC CORP 发明人 NIKAIDO MASAHIKO
分类号 H01L21/60;H01L21/50;(IPC1-7):H01L21/60 主分类号 H01L21/60
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