FORMATION OF MULTILAYER RESIST PATTERN AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a method of forming a multilayer resist pattern which enables formation of a lower layer resist pattern and an upper layer resist pattern to a desired pattern configuration. CONSTITUTION:After a lower layer resist pattern 6 is formed and the lower resist pattern 6 is heated baked to a temperature exceeding a glass dislocation temperature, an upper resist pattern 7 is formed on the lower layer resist pattern 6 whose crystallinity is improved by heating.