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发明名称
REMOVAL APPARATUS OF RESIN BURR OF RESIN-SEALED SEMICONDUCTOR
摘要
申请公布号
JPH07169783(A)
申请公布日期
1995.07.04
申请号
JP19930313906
申请日期
1993.12.15
申请人
TOSHIBA CORP
发明人
TAKEGAWA YUJI
分类号
H01L21/56;H01L23/50;(IPC1-7):H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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