| 摘要 |
<p>PURPOSE:To prevent the leg of a lead pin from being bent and at the same time to increase the mounting reliability of the lead pin onto a substrate. CONSTITUTION:This semiconductor device has two-layered structure in which lead pins 10 are bonded to a pair of conductive layers 7, 8 through an insulating film 9, and a pair of bent parts 7a, 8a in which the paired conductive layers 7, 8 are bent in the reverse direction to each other at the tips of the lead pins are formed.</p> |
