| 摘要 |
PURPOSE:To cut the semiconductor device tie-bars of different standards in a die structure with which the tie bars of the lead frame of a semiconductor device is cut. CONSTITUTION:A die holder 1, with which a tie bar cutting die 7 is fixed and supported, and a punch holder 3, which fixes and supports a tie bar cutting pad 11 and a punch 12 with the coaction of the die 7, are provided. For a semiconductor device 5 having different standards, the fixing position of the die 7 is variable for the die holder 1, and the pad 11 and the punch 12 can be replaced with those having different standard in accordance with the standard of the tie bar to be cut. By unnecessitating the replacement of the die, its handling becomes easy, and the preparation of a number of kinds of dies is unnecessitated. |
