发明名称 Resin-sealing apparatus including a gas spring
摘要 A gas spring (602) is used as a buffer device in a resin-sealing apparatus for applying a compressive force to a plunger (15). In the gas spring (602), the compressive force at which a compression displacement starts is easily established as required, and the increasing degree of the compressive force with increasing compression displacement is established slowly without difficulty. Any errors in applying resin injection pressures to a plurality of plungers, due to variations in the amount of resin of tablets and in length of plungers, are absorbed in a wide range of the compression displacements thereof so that the resin injection pressures in practice are substantially equalized.
申请公布号 US5413471(A) 申请公布日期 1995.05.09
申请号 US19930016371 申请日期 1993.02.11
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YAMAUCHI, SHUNJI
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/77;B29C45/78;B29K105/20;B29L31/34;F16F9/00;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
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