发明名称 METHOD OF BONDING METAL WIRE
摘要 PROBLEM TO BE SOLVED: To provide a method of bonding metal wire by which a metal wire can be bonded to electrodes, without lowering the breaking strength of the wire nor bringing the front end portion of a bonding tool into collision with the base structures, etc., of the electrodes and the bonding spots and bonding operation can be monitored fully. SOLUTION: This method includes a first step of bonding the metal wire 15 to electrodes provided at both ends of the wire 15 through wedge-bonding method, a second step of cutting the wire 15, and a third step of bonding the intermediate section of the wire 15 to an electrode provided at a mid-point by the press-bonding method to connect three or more electrodes to each other through one metal wire 15.
申请公布号 JP2002208609(A) 申请公布日期 2002.07.26
申请号 JP20010001213 申请日期 2001.01.09
申请人 OKI ELECTRIC IND CO LTD 发明人 YAMADA MITSUSHI
分类号 H01L21/60 主分类号 H01L21/60
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