FABRICATION OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To increase the yield in a step for pellet bonding a semiconductor chip to a lead frame of lead on chip (LOC) structure. CONSTITUTION:When the position of a bonding pad 3 formed by making an opening through a surface protective film 2 formed on a semiconductor chip 1 is recognized visually, the profile of opening is differentiated between the end part and the inner part of a row of pads. This arrangement allows accurate recognition of the position of bonding pad 3 at the end part of a row of pads.