| 摘要 |
<p>PURPOSE:To provide a vertical mounting semiconductor package module excellent in the heat dissipation characteristics and mounting efficiency. CONSTITUTION:The semiconductor package module 21 comprises at least a pair of vertical mounting semiconductor devices 22 wherein the semiconductor device 22 comprises a semiconductor element 5, a package 3 sealing the semiconductor element 5, and leads 2 each having one end connected electrically with the semiconductor element and the other end exposed from the lower surface of the package 3. The semiconductor package module 21 further comprises a metal plate 6 for supporting each semiconductor element 2 while insulating electrically, a heat transmission plate 23 interposed at least between a pair of semiconductor devices 22 continuously to at least one metal plate 6, and heat dissipation fins 26 disposed contiguously to the heat transmission plate 23 while being exposed from the upper surface 24 of the package 3.</p> |
