发明名称 Gerät zur nacheinanderfolgenden Verbindung von elektrischen Leiterplatten.
摘要 An electrical circuit board interconnection system having motherboard 13 and a plurality of option board assemblies 10. Each option board assembly 10 has circuit board 15 to which is attached male pin connector assembly 12 on one surface and a mating female connector assembly 11 on the other surface. Both connector assemblies are oriented with pins 17 and female receptacles 18 parallel to the surface of boards 15. Ejector levers 14 attached to female connector 11 to bear against male pin housing 36 to assist in disconnection option boards 10 from each other and motherboard 13. Power transfer bus 42 and signal transfer bus 43 interconnect the male and female pin connectors 12 and 11 of each circuit board 15 to facilitate the sequential interconnection of a plurality of option board assemblies 10 to motherboard 13.
申请公布号 DE69017250(D1) 申请公布日期 1995.04.06
申请号 DE1990617250 申请日期 1990.04.04
申请人 HEWLETT-PACKARD CO., PALO ALTO, CALIF., US 发明人 BEAUFORT, RICHARD, BOISE, IDAHO 83704, US;COX, DARRELL, BOISE, IDAHO 83702, US;SANGRONIZ, JAMES, BOISE, IDAHO 83702, US
分类号 H01R12/50;H01R12/70;H01R12/71;H01R12/73;H05K1/14;H05K3/36;H05K7/14 主分类号 H01R12/50
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