| 摘要 |
<p>PURPOSE:To provide a bump connection type IC module having high bonding strength of an IC chip. CONSTITUTION:When an IC chip 13 is placed and adhered to a printed board 12, a dummy bump 19 isolated from a normal bump 18 is arranged. The bump 19 remarkably enhances a bonding strength of the chip 13 to the board 12 at the time of resin sealing. In order to enhance the bonding strength of the bump 19 to the board 12, a dummy wiring pattern 20 is also arranged.</p> |
