| 摘要 |
PURPOSE:To execute the infiltration of resin forming component in pattern material and the bonding between the pattern material and base plate in the same process and form thick bonding layer with favorable workability. CONSTITUTION:After polymerizable resin solution is applied onto the surface of base plate, the solution is partially polymerized under air atmosphere with electron rays and/or heat so as to form partially polymerized gel layer, in which the contents of polymer is increased by the range not exceeding 90% and the range of 10-72% of the contents of the polymer in the polymerizable resin solution, on the surface of the base plate. Then, under the condition that pattern material is arranged on the partially polymerized gel layer, pressure and heat are applied on the resultant assembly so as to produce the laminate. |
