THERMOPLASTIC RESIN COMPOSITION

摘要

THERMOPLASTIC RESIN COMPOSITION The present invention provides a thermoplastic resin composition improved in stability at the time of processing which comprises (a) 100 parts by of a polyphenylene ether resin and (b) 0.001-15 parts by weight of at least one 4-amino-2,2,6,6-tetramethyl-piperidyl compound represented by the following formula (I) or (II): <IMG> (I) <IMG> (II) wherein R1 represents a hydrogen atom, an oxygen atom (oxy radical), a hydroxyl group, an alkyl group, a cycloalkyl group, an allyl group, a benzyl group, an aryl group, an alkanoyl group, an alkenoyl group, an alkyloxy group or a cycloalkyloxy group; R2 represents a hydrogen atom, an alkyl group or <IMG> where X represents a direct bond, -O- or -NH-, R4 represents a direct bond, a straight or branched alkylene group, an alkylidene group or an arylene group, R5 represents a hydrogen atom, an alkyl group, an aryl group, -CH=CH?OH or <IMG> , n represents an integer of 1 to 4, p represents an integer of 2 to 6, and R3 represents an n valent organic group.