| 摘要 |
The present invention relates to a base part serving as heat sink in a plastic package (7), the upper face (11) of the base part being in thermal contact with a semiconductor chip (1), the lower face (15) coming flush at the level of a main face of the package (7). This base part is formed from a substantially square metal sheet, each of the corners of which is folded into a tab (15) so as to obtain a substantially square base part, the face comprising folds corresponding to the lower face of the base part. <IMAGE> |
