| 摘要 |
<p>Two prefabricated conductors (114 and 152) are connected with a via-like structure comprising a conducting strap (116) passing through a hole in a dielectric (115). Unlike the commonly used traditional via structures requiring that connecting holes be made before fabrication of the upper level of the conducting wires, the disclosed structure can be completed by making said hole and strap after both conductors are already fabricated. This delays connecting the wires in an integrated circuit until late in the fabrication process, thereby reducing the time and cost required to customize the interconnections in a prefabricated general-purpose mask-programmable circuit resembling a gate array. Several variants of the basic method are possible, differing in the exact configurations of the via-like structure and in the exact process used to fabricate the conducting strap.</p> |
