发明名称 METHOD AND DEVICE OF CLEANING SUBSTRATE
摘要 <p>PURPOSE:To provide a method and a device for cleaning a substrate high in cleanness. CONSTITUTION:In a cleaning method wherein fine particles adhering to a substrate 5 are removed by cleaning liquid, a first cleaning process wherein cleaning liquid L1 given ultrasonic vibrations is sprayed on a substrate and a second cleaning process wherein cleaning liquid L2 of higher pressure than the cleaning liquid L1 is sprayed on the ultrasonically cleaned wafer are provided.</p>
申请公布号 JPH076991(A) 申请公布日期 1995.01.10
申请号 JP19930143409 申请日期 1993.06.15
申请人 TOSHIBA CORP;SHIBAURA ENG WORKS CO LTD 发明人 SAKURAI NAOAKI;KUROKAWA SADAAKI
分类号 B08B3/12;G03F1/82;H01L21/304;(IPC1-7):H01L21/304;G03F1/08 主分类号 B08B3/12
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