发明名称 |
METHOD AND DEVICE OF CLEANING SUBSTRATE |
摘要 |
<p>PURPOSE:To provide a method and a device for cleaning a substrate high in cleanness. CONSTITUTION:In a cleaning method wherein fine particles adhering to a substrate 5 are removed by cleaning liquid, a first cleaning process wherein cleaning liquid L1 given ultrasonic vibrations is sprayed on a substrate and a second cleaning process wherein cleaning liquid L2 of higher pressure than the cleaning liquid L1 is sprayed on the ultrasonically cleaned wafer are provided.</p> |
申请公布号 |
JPH076991(A) |
申请公布日期 |
1995.01.10 |
申请号 |
JP19930143409 |
申请日期 |
1993.06.15 |
申请人 |
TOSHIBA CORP;SHIBAURA ENG WORKS CO LTD |
发明人 |
SAKURAI NAOAKI;KUROKAWA SADAAKI |
分类号 |
B08B3/12;G03F1/82;H01L21/304;(IPC1-7):H01L21/304;G03F1/08 |
主分类号 |
B08B3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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