发明名称 EXTRUSION MOLDING METHOD OF SYNTHETIC RESIN PLATE
摘要 PURPOSE:To provide an extrusion molding method of synthetic resin plate, which can perform extrusion molding of the synthetic resin plate having a glossy and smooth surface by excluding nonuniform thickness of a widthwise direction and a stepped surface even in the case where the resin plate is a thick synthetic resin plate. CONSTITUTION:Boardlike resin through an extrusion machine 1 is allowed to pass through between a first roll 31 and a second roll 32 and between the second roll 32 and third roll 33 of a polishing roll 3 in order, the rear of which is run toward a cooling zone 4 through the polishing roll 3 under a condition wherein the rear is brought into contact with a semicircular surface of the third roll 33 and allowed to pass further through a molding apparatus to smoothen the surface of the boardlike resin in a space between the polishing roll 3 and cooling zone 4 and cooled finally in the cooling zone 4.
申请公布号 JPH071537(A) 申请公布日期 1995.01.06
申请号 JP19930149092 申请日期 1993.06.21
申请人 SEKISUI CHEM CO LTD 发明人 TERAI MINORU
分类号 B29C47/00;B29L7/00;(IPC1-7):B29C47/00 主分类号 B29C47/00
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