| 摘要 |
A molded plastic package for an integrated-circuit die includes a lead frame having inwardly extending tie bars and a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. At least one holes is formed through a portion of the lead frame and is engaged by a corresponding elongated stud on the heat sink. The elongated stud extends upwardly through the layer of thermal grease through the holes in the lead frame and terminates at the top of the molded plastic package. By extending to the top of the plastic package, the elongated stud firmly holds the heat sink against the bottom of the mold cavity during the encapsulation process. As a result, the bottom surface of the heat sink remains exposed after the encapsulation process. |
